Evertiq TEC conference, Lund Medicon Village 28.09.

July 2017: In this year’s TEC Lund conference we will present “3D-MID Prototyping”.

Learn more about the workflow from designing a three dimensional circuit carrier to the ready assembled prototype.

The presentation starts Sept. 28th at 9:55h at Medicon Village. At our stand you can evaluate 3D-MID samples from Beta LAYOUTs production and get more detailed information.

Register for free admission under http://evertiq.com/tec/lun2017_visit_460 and join the conference! Free lunch buffet and coffee breaks are provided.